Vacuum In‑Mold Potting Molding
Technology Introduction
Rocktin vacuum in‑mold potting molding packaging process is suitable for various special‑shaped precision electronic components. It completely eliminates bubble defects of traditional potting, and finished products feature excellent insulation, heat dissipation, waterproof and anti‑vibration performance, effectively extending the service life of components. It provides one‑stop complete solutions covering customized packaging process, tooling and OEM service
Vacuum In‑Mold Potting Molding
Bubble‑Free Forming With Uniform Encapsulation
Configurable Dielectric Media, Compatible With Special‑Shaped Devices
Comprehensive Protection With Insulation, Heat Dissipation And Waterproof Performance
Learn More & Contact Us
You may submit your requirements or schedule a technical consultation via our contact page. From single-machine selection to full-line automation upgrading, our professional team is ready to provide you with customized solutions and technical support.