Underfill
Technology Introduction
Rocktin underfill features fast curing, high flow and low stress. It is capable of filling micron‑scale gaps of chips, applicable to precision components including consumer electronics, automotive electronics, AI advanced packaging, new‑energy devices and industrial control boards. It relieves thermal stress, provides vibration resistance and drop protection, and fits high‑speed production lines
Underfill
Excellent Leveling & Penetration To Solve Micron‑Scale Packaging Pain Points
Reliable Temperature And Vibration Resistance To Ensure Long‑Term Device Operation
High‑Speed Production Line Adaptation, Cost Reduction For Import Substitution
Learn More & Contact Us
You may submit your requirements or schedule a technical consultation via our contact page. From single-machine selection to full-line automation upgrading, our professional team is ready to provide you with customized solutions and technical support.